High Complexity PCB Assembly PCBA
| Service Feature | Capability Details |
|---|---|
| Turnkey Service | PCB Design + PCB FAB + Component Sourcing + PCBA + Box Building + Packaging |
| Value-Added Services | BOM Analysis, Conformal Coating, IC Programming, Wire Harness, Ageing & Testing |
| Assembly Capacity | SMT: 30 Million points/day; DIP: 100,000 pieces/day |
| Quality Standards | IPC-A-610 Class 2 / Class 3 (Medical Grade) |
| Inspection & Testing | 3D SPI + 3D AOI, X-ray, Flying Probe, ICT, FCT, Burn-in Test |
| Component Size | Passive: 0201 (01005 support); Fine-pitch BGA, QFN, CSP, WLCSP |
| Placement Precision | ±0.03mm / ±0.01mm (Chip) |
| Certifications | ISO 13485:2016, IATF 16949, ISO 9001, UL, CE, RoHS |
For over 20 years, we have dedicated ourselves to serving industries including medical devices, automotive electronics, new energy, rail transit, and many others. We provide end-to-end turnkey services, encompassing BOM sourcing, product design solutions, SMT assembly, THT assembly, wire harness processing, conformal coating, box build assembly, and logistics delivery.
Our production facilities cover a total area of approximately 28,000 square meters. Our facilities include a Class 10,000 cleanroom of around 10,000 square meters, dedicated RoHS-compliant workshops, and specialized lines for small-batch trial production. Our production base features world-class hardware, including Japanese high-speed mounters and nitrogen reflow ovens.